DocumentCode :
3201249
Title :
TEM/EDX analysis of bacterial spores treated by nanosecond pulsed electric fields
Author :
Arikawa, K. ; Choi, J. ; Namihira, T. ; Sakugawa, T. ; Katsuki, S. ; Akiyama, H. ; Seta, H. ; Shoen, T. ; Ando, N.
Author_Institution :
Grad. Sch. of Sci. & Technol., Kumamoto Univ., Kumamoto, Japan
fYear :
2009
fDate :
June 28 2009-July 2 2009
Firstpage :
1061
Lastpage :
1064
Abstract :
This paper describes killing bacterial spores using highly energized pulsed electric fields under pressurized conditions. B. subtilis spores suspended in a conductive liquid were repetitively subjected to 100 kV/cm, 100 ns pulsed electric fields. The PEF treatment lowers the sterilization temperature by 10°C and the spore number was reduced by the logarithmic number of 6.7. Also the killing mechanism was discussed on the basis of element analysis using a transmission electron microscopy (TEM) equipped with an energy dispersive X-ray spectrometer (EDX). In the heat treatment (121°C, 14 s), the core contents including phosphorus leak into cortex which indicates the damage of the inner membrane, whereas the coat structure still remains. Both the core membrane and the coat were damaged in the PEF treatment.
Keywords :
X-ray chemical analysis; bioelectric phenomena; biological effects of fields; biomembranes; biotechnology; biothermics; cellular biophysics; microorganisms; sterilisation (microbiological); transmission electron microscopy; B. subtilis spores; EDX; TEM; bacterial spores; coat structure; conductive liquid; cortex; element analysis; energy dispersive X-ray spectrometer; inner membrane; nanosecond pulsed electric fields; phosphorus leak; sterilization; temperature 10 degC; temperature 121 degC; time 100 ns; time 14 s; transmission electron microscopy; Biomembranes; Chemicals; Dispersion; Fungi; Magnetic materials; Microorganisms; Pulse compression methods; Spectroscopy; Temperature; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Pulsed Power Conference, 2009. PPC '09. IEEE
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-4064-1
Electronic_ISBN :
978-1-4244-4065-8
Type :
conf
DOI :
10.1109/PPC.2009.5386136
Filename :
5386136
Link To Document :
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