• DocumentCode
    3201938
  • Title

    FTIR Analysis of Microwave-Excited PECVD Silicon Nitride Layers

  • Author

    Cuevas, Andres ; Chen, Florence ; Tan, Jason ; Mackel, Helmut ; Winderbaum, Saul ; Roth, Kristin

  • Author_Institution
    Dept. of Eng., Australian Nat. Univ., Canberra, ACT
  • Volume
    1
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    1148
  • Lastpage
    1151
  • Abstract
    This paper presents infrared absorption (FTIR) measurements of SiN layers and correlates them to their ability to passivate silicon wafer surfaces. The best passivation was obtained for films having a nitrogen to silicon atomic composition in the proximity of N/Si=1.2, together with a high concentration of Si-N bonds (approximately 1times1023 cm-3) and a refractive index in the vicinity of n=2. The total hydrogen concentration in these films remained practically unchanged after a high temperature firing cycle, which indicates a good thermal stability. In contrast, silicon rich layers (higher refractive index and lower Si-N bond density) suffered a large reduction in the total hydrogen content. These results support the suggestion by ECN researchers that the Si-N bond concentration can be a good indicator of the ultimate electronic impact of the SiN layers
  • Keywords
    Fourier transform spectra; elemental semiconductors; firing (materials); infrared spectra; passivation; plasma CVD; refractive index; silicon; silicon compounds; thermal stability; thin films; FTIR analysis; Si; Si-N bonds; SiN; high temperature firing; hydrogen concentration; microwave-excited PECVD silicon nitride layers; passivation; refractive index; silicon atomic composition; silicon wafer surface; thermal stability; Atomic layer deposition; Atomic measurements; Electromagnetic wave absorption; Hydrogen; Nitrogen; Optical films; Passivation; Refractive index; Semiconductor films; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279365
  • Filename
    4059838