• DocumentCode
    3202127
  • Title

    High thermal stability metal gate with tunable work function

  • Author

    Huang, Chih-Feng ; Tsui, Bing-Yue

  • Author_Institution
    Inst. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    2
  • fYear
    2004
  • fDate
    16-19 May 2004
  • Firstpage
    451
  • Abstract
    It has been reported that the work function of Ta-Pt alloys is tunable and Ta-Pt is a possible gate material for CMOS devices. In this work, we demonstrate that the Ta-Pt alloy is thermally stable up to 900 °C. The impact of oxygen contamination and thermal stress on the stability of the MOS structure with the alloy gate is also discussed. It is concluded that the Ta-Pt alloy is a good candidate for gate electrode in the nanoscale CMOS regime and is compatible with the conventional self-aligned process.
  • Keywords
    CMOS integrated circuits; metallic thin films; nanoelectronics; platinum alloys; tantalum alloys; thermal stability; thermal stresses; work function; 900 degC; CMOS devices; Ta-Pt; Ta-Pt alloys; high thermal stability metal gate; nanoscale CMOS regime; oxygen contamination; thermal stress; tunable work function; Dielectric substrates; Electrodes; Nickel alloys; Plasma temperature; Platinum alloys; Potential well; Semiconductor films; Silicon; Thermal stability; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2004. 24th International Conference on
  • Print_ISBN
    0-7803-8166-1
  • Type

    conf

  • DOI
    10.1109/ICMEL.2004.1314860
  • Filename
    1314860