DocumentCode
3202127
Title
High thermal stability metal gate with tunable work function
Author
Huang, Chih-Feng ; Tsui, Bing-Yue
Author_Institution
Inst. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
2
fYear
2004
fDate
16-19 May 2004
Firstpage
451
Abstract
It has been reported that the work function of Ta-Pt alloys is tunable and Ta-Pt is a possible gate material for CMOS devices. In this work, we demonstrate that the Ta-Pt alloy is thermally stable up to 900 °C. The impact of oxygen contamination and thermal stress on the stability of the MOS structure with the alloy gate is also discussed. It is concluded that the Ta-Pt alloy is a good candidate for gate electrode in the nanoscale CMOS regime and is compatible with the conventional self-aligned process.
Keywords
CMOS integrated circuits; metallic thin films; nanoelectronics; platinum alloys; tantalum alloys; thermal stability; thermal stresses; work function; 900 degC; CMOS devices; Ta-Pt; Ta-Pt alloys; high thermal stability metal gate; nanoscale CMOS regime; oxygen contamination; thermal stress; tunable work function; Dielectric substrates; Electrodes; Nickel alloys; Plasma temperature; Platinum alloys; Potential well; Semiconductor films; Silicon; Thermal stability; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2004. 24th International Conference on
Print_ISBN
0-7803-8166-1
Type
conf
DOI
10.1109/ICMEL.2004.1314860
Filename
1314860
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