DocumentCode :
3202236
Title :
Contact pressure monitoring device for sleep studies
Author :
Pino, Esteban J. ; Dorner de la Paz, Astrid ; Aqueveque, Pablo ; Chavez, Javier A. P. ; Moran, Alejandra A.
Author_Institution :
Dept. of Electr. Eng., Univ. de Concepcion, Concepcion, Chile
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
4160
Lastpage :
4163
Abstract :
This project implements a non-invasive sleep monitoring system using a bed pressure sensor array. The system detects changes in the contact pressure between a subject and the bed and is able to automatically select the sensor with the best respiratory signal, determine the respiratory rate (RR), count number of sleep apneas and count body position changes through the night. The respiratory signal is validated with an airflow sensor using Pearson´s correlation coefficient. To determine the performance of body position and apnea detection algorithms, the sensibility and positive predictivity is computed on preliminary data and known records from a Physionet database. Real data is obtained from 5 subjects totaling 39 hours measured at home during a full night sleep, in a non-invasive way. The data is used to calculate relevant parameters to estimate a sleep quality. Cumulative frequency of sleep interval duration is proposed as a novel metric for sleep assessment.
Keywords :
flow sensors; medical disorders; medical signal detection; patient diagnosis; patient monitoring; pneumodynamics; pressure sensors; sleep; Pearson´s correlation coefficient; Physionet database; airflow sensor; apnea detection algorithm; bed pressure sensor array; body position change; contact pressure monitoring device; cumulative frequency; noninvasive sleep monitoring system; respiratory rate; respiratory signal; sleep apnea count number; sleep assessment; sleep interval duration; sleep quality estimation; Arrays; Indexes; Monitoring; Silicon; Sleep apnea; Standards;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610461
Filename :
6610461
Link To Document :
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