Title : 
Rapid thermal oxidation of Ge-rich strained layers
         
        
            Author : 
Das, S. ; Chakraborty, S. ; Bhattacharya, S. ; Bain, M. ; McCarthy, J. ; Armstrong, B.M. ; Gamble, H.S. ; Dalapati, G.K. ; Samanta, S.K. ; Perova, T.S. ; Moore, R.A. ; Maiti, C.K.
         
        
            Author_Institution : 
Dept. of Electron. & Electr. Commun. Eng., Indian Inst. of Technol., Kharagpur, India
         
        
        
        
        
        
            Abstract : 
In this paper, we report for the first time the electrical properties of ultrathin oxides grown using rapid thermal oxidation (RTO) on strained Ge-rich layers on relaxed-SiGe buffers. Rapid thermal oxidation on strained Ge-rich layer is employed to prevent strain relaxation. Electrical properties of MOS capacitors fabricated using RTO grown oxides directly on strained Ge-rich has been studied in detail using capacitance-voltage (C-V), conductance-voltage (G-V) and current-voltage (I-V) characteristics. Interface trap density, fixed oxide charge density, the frequency dispersion and hysteresis effects of the oxide have been determined. From the I-V characteristics, the current conduction mechanism has also been studied. RTO grown oxides show good electrical properties and may find applications in the future generation Ge-CMOS as a gate dielectric.
         
        
            Keywords : 
Ge-Si alloys; MOS capacitors; electrical conductivity; interface states; oxidation; rapid thermal processing; Ge-rich strained layers; GeSi; MOS capacitors; electrical properties; fixed oxide charge density; frequency dispersion; hysteresis effects; interface trap density; rapid thermal oxidation; relaxed-SiGe buffers; CMOS technology; Capacitance-voltage characteristics; Capacitive sensors; Dielectrics; Hafnium; Oxidation; Passivation; Rapid thermal processing; Rough surfaces; Surface roughness;
         
        
        
        
            Conference_Titel : 
Microelectronics, 2004. 24th International Conference on
         
        
            Print_ISBN : 
0-7803-8166-1
         
        
        
            DOI : 
10.1109/ICMEL.2004.1314867