Title :
Photonics and electronics integration in the HELIOS project
Author :
Fedeli, J.M. ; Augendre, E. ; Hartmann, J.-M. ; Vivien, L. ; Grosse, P. ; Mazzocchi, V. ; Bogaerts, W. ; Van Thourhout, D. ; Schrank, F.
Author_Institution :
LETI, Minatec, Grenoble, France
Abstract :
The objective of the European project HELIOS is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics processes. Bonding of AWG + Ge Photodiodes on CMOS wafer is achieved.
Keywords :
CMOS integrated circuits; elemental semiconductors; germanium; integrated optoelectronics; micro-optics; optical receivers; photodetectors; wafer bonding; AWG-Ge photodiodes; CMOS circuit; HELIOS project; electronics integration; microelectronics; photonics integration; wafer bonding; Arrayed waveguide gratings; CMOS integrated circuits; Metals; Photodiodes; Photonics; Silicon; Through-silicon vias;
Conference_Titel :
Group IV Photonics (GFP), 2010 7th IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-6344-2
DOI :
10.1109/GROUP4.2010.5643326
