Title :
Single-trial laser-evoked potentials feature extraction for prediction of pain perception
Author :
Gan Huang ; Ping Xiao ; Li Hu ; Hung, Y.S. ; Zhiguo Zhang
Author_Institution :
Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
Abstract :
Pain is a highly subjective experience, and the availability of an objective assessment of pain perception would be of great importance for both basic and clinical applications. The objective of the present study is to develop a novel approach to extract pain-related features from single-trial laser-evoked potentials (LEPs) for classification of pain perception. The single-trial LEP feature extraction approach combines a spatial filtering using common spatial pattern (CSP) and a multiple linear regression (MLR). The CSP method is effective in separating laser-evoked EEG response from ongoing EEG activity, while MLR is capable of automatically estimating the amplitudes and latencies of N2 and P2 from single-trial LEP waveforms. The extracted single-trial LEP features are used in a Naïve Bayes classifier to classify different levels of pain perceived by the subjects. The experimental results show that the proposed single-trial LEP feature extraction approach can effectively extract pain-related LEP features for achieving high classification accuracy.
Keywords :
Bayes methods; electroencephalography; feature extraction; medical signal processing; regression analysis; signal classification; Bayes classifier; CSP method; EEG activity; MLR; high classification accuracy; high subjective experience; laser-evoked EEG response; multiple linear regression; pain perception classification; pain perception prediction; pain-related LEP features; single-trial LEP feature extraction approaches; single-trial LEP waveforms; single-trial laser-evoked potentials; Accuracy; Band-pass filters; Electroencephalography; Feature extraction; Lasers; Pain; Training;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6610473