Title : 
Feasibility study of low-swing clocking
         
        
            Author : 
Markovic, Dejan ; Tschanz, James ; De, Vivek
         
        
            Author_Institution : 
Berkeley Wireless Res. Center, California Univ., Berkeley, CA, USA
         
        
        
        
        
        
            Abstract : 
This paper evaluates the feasibility of low-swing clocking under no performance degradation constraint. We consider flip-flops, logic and clock distribution network in our analysis. The preferred flip-flop topologies for low-swing clocking (low-VClk) are different from those normally used in a full-swing (high-VClk) design. Clock buffers are redesigned to accommodate reduced drive current under low-VClk. In order to maintain performance, logic and flip-flops must absorb increase in clock skew due to low-VClk. In a 64-bit ALU design, the optimal low-VClk design point is at the minimum energy-delay product (EDP) point of the high-VClk design, with no delay or energy penalty in the ALU itself. A 43% energy reduction achieved in the clock distribution network results in a 13% overall energy savings due to low-VClk, assuming that the clocking energy is 40% of the total energy tinder high-VClk. For performance targets of at least one FO4 inverter delay better than the min-EDP point, low-swing clocking becomes ineffective because of a high energy cost in logic that is spent to absorb increase in flip-flop delay and clock skew. Finally, low-VClk cannot achieve the peak performance of the high-VClk design due to slower flip-flops and higher clock uncertainty at low-VClk.
         
        
            Keywords : 
VLSI; flip-flops; synchronisation; clock distribution network; clock skew; flip-flops; logic distribution network; low-swing clocking; performance degradation constraint; CMOS technology; Clocks; Degradation; Delay; Energy consumption; Flip-flops; Logic; Network topology; Power generation; Voltage;
         
        
        
        
            Conference_Titel : 
Microelectronics, 2004. 24th International Conference on
         
        
            Print_ISBN : 
0-7803-8166-1
         
        
        
            DOI : 
10.1109/ICMEL.2004.1314884