Title :
Packaging of SOI motherboards for highspeed all optical router applications
Author :
Zimmermann, L. ; Voigt, K. ; Winzer, G. ; Landles, K. ; Lynn, J. ; Duffy, S.
Author_Institution :
IHP Microelectron. GmbH, Frankfurt (Oder), Germany
Abstract :
In this paper we present packaging developments around SOI high speed all optical router boards. We shall prove the feasibility of our approach by experimental figures for pigtailing power penalty.
Keywords :
integrated optics; integrated optoelectronics; packaging; silicon-on-insulator; SOI high speed all optical router boards; SOI motherboards packaging; highspeed all optical router; packaging developments; silicon-on-insulator; Insertion loss; Optical device fabrication; Optical fiber devices; Optical fiber polarization; Packaging;
Conference_Titel :
Group IV Photonics (GFP), 2010 7th IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-6344-2
DOI :
10.1109/GROUP4.2010.5643352
