• DocumentCode
    3202821
  • Title

    Packaging of SOI motherboards for highspeed all optical router applications

  • Author

    Zimmermann, L. ; Voigt, K. ; Winzer, G. ; Landles, K. ; Lynn, J. ; Duffy, S.

  • Author_Institution
    IHP Microelectron. GmbH, Frankfurt (Oder), Germany
  • fYear
    2010
  • fDate
    1-3 Sept. 2010
  • Firstpage
    281
  • Lastpage
    283
  • Abstract
    In this paper we present packaging developments around SOI high speed all optical router boards. We shall prove the feasibility of our approach by experimental figures for pigtailing power penalty.
  • Keywords
    integrated optics; integrated optoelectronics; packaging; silicon-on-insulator; SOI high speed all optical router boards; SOI motherboards packaging; highspeed all optical router; packaging developments; silicon-on-insulator; Insertion loss; Optical device fabrication; Optical fiber devices; Optical fiber polarization; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2010 7th IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-6344-2
  • Type

    conf

  • DOI
    10.1109/GROUP4.2010.5643352
  • Filename
    5643352
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3202821