• DocumentCode
    3203208
  • Title

    Characterization of differential interconnects from time domain reflectometry measurements

  • Author

    Tolescu, Aurelian ; Svasta, Paul

  • Author_Institution
    Bucharest Politehnica Univ., Romania
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    298
  • Lastpage
    301
  • Abstract
    Differential signaling schemes are a common approach to achieving higher noise immunity for critical signals in a high-speed digital design. A differential pair constitutes a set of coupled transmission lines and, therefore, can be modeled and simulated as such. Short differential lines can be modeled using coupled LC matrices, but a distributed model is required for longer lines. In this article, a technique for extracting such a distributed coupled line model from time domain reflectometry (TDR) measurements is presented. This model can be easily utilized in a SPICE simulator, making it extremely useful for high-speed differential interconnect modeling and simulation. The resulting accurate models help the designer to achieve a better understanding of the differential interconnects, resulting in higher performance system design
  • Keywords
    SPICE; circuit noise; circuit simulation; coupled transmission lines; digital circuits; interconnections; printed circuit testing; time-domain reflectometry; transmission line theory; SPICE simulator; TDR measurements; coupled LC matrices; coupled transmission line modeling; coupled transmission line simulation; coupled transmission lines; critical signals; differential interconnects; differential pair; differential signaling schemes; distributed coupled line model; distributed model; high-speed differential interconnect modeling; high-speed differential interconnect simulation; high-speed digital design; noise immunity; short differential lines; system design; time domain reflectometry measurements; Capacitance; Conductors; Couplings; Distributed parameter circuits; Driver circuits; Impedance; Integrated circuit interconnections; Reflectometry; Time measurement; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
  • Conference_Location
    Calimanesti-Caciulata
  • Print_ISBN
    0-7803-7111-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2001.931087
  • Filename
    931087