DocumentCode :
3203208
Title :
Characterization of differential interconnects from time domain reflectometry measurements
Author :
Tolescu, Aurelian ; Svasta, Paul
Author_Institution :
Bucharest Politehnica Univ., Romania
fYear :
2001
fDate :
2001
Firstpage :
298
Lastpage :
301
Abstract :
Differential signaling schemes are a common approach to achieving higher noise immunity for critical signals in a high-speed digital design. A differential pair constitutes a set of coupled transmission lines and, therefore, can be modeled and simulated as such. Short differential lines can be modeled using coupled LC matrices, but a distributed model is required for longer lines. In this article, a technique for extracting such a distributed coupled line model from time domain reflectometry (TDR) measurements is presented. This model can be easily utilized in a SPICE simulator, making it extremely useful for high-speed differential interconnect modeling and simulation. The resulting accurate models help the designer to achieve a better understanding of the differential interconnects, resulting in higher performance system design
Keywords :
SPICE; circuit noise; circuit simulation; coupled transmission lines; digital circuits; interconnections; printed circuit testing; time-domain reflectometry; transmission line theory; SPICE simulator; TDR measurements; coupled LC matrices; coupled transmission line modeling; coupled transmission line simulation; coupled transmission lines; critical signals; differential interconnects; differential pair; differential signaling schemes; distributed coupled line model; distributed model; high-speed differential interconnect modeling; high-speed differential interconnect simulation; high-speed digital design; noise immunity; short differential lines; system design; time domain reflectometry measurements; Capacitance; Conductors; Couplings; Distributed parameter circuits; Driver circuits; Impedance; Integrated circuit interconnections; Reflectometry; Time measurement; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Conference_Location :
Calimanesti-Caciulata
Print_ISBN :
0-7803-7111-9
Type :
conf
DOI :
10.1109/ISSE.2001.931087
Filename :
931087
Link To Document :
بازگشت