DocumentCode :
3203390
Title :
10 Ã\x97 10 cm2 Hit Solar Cells Contacted with Lead-Free Electrical Conductive Adhesives to Solar Cell Interconnectors
Author :
Scherff, Maximilian L D ; Schwertheim, Stefan ; Ma, Yue ; Mueller, Thomas ; Fahrner, Wolfgang R.
Author_Institution :
Univ. of Hagen
Volume :
2
fYear :
2006
fDate :
38838
Firstpage :
1384
Lastpage :
1387
Abstract :
In the present study we have investigated the optical and electrical properties of 10 × 10 cm2 HIT solar cells with evaporated Cr/Ag grids. Contacts were done with low temperature lead-free electrically conductive adhesives to standard solar cell interconnector tabs (IT). Compared to solder joints conductive adhesives have the advantage of lower contact formation temperature with reasonable low contact resistances (less than 1 m¿cm2). ITs glued directly on ITO are not long term stable if the applied pressure during manufacturing is too low. Their contact resistance increases by about three to four orders of magnitude after 50 temperature cycles (¿40 °C / 85 °C). Thin Ag layers beneath the glue avoid contact degradation. Depending on the contact gluing process parameters (temperature, time, pressure and glue material) especially on textured substrates the polymer constituent of the conductive adhesive can bleed out into the solar cell light exposed area and provoke a higher optical reflection.
Keywords :
adhesives; contact resistance; hydrogen; interconnections; semiconductor heterojunctions; silicon; silicon compounds; solar cells; HIT; Si:H-Si; adhesives; contact resistances; electrical properties; heterojunction intrinsic thin films; lead-free electrical conductivity; optical properties; optical reflection; solder joints; standard solar cell interconnector tabs; Chromium; Conductive adhesives; Contacts; Environmentally friendly manufacturing techniques; Indium tin oxide; Lead; Optical interconnections; Photovoltaic cells; Soldering; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
Type :
conf
DOI :
10.1109/WCPEC.2006.279709
Filename :
4059904
Link To Document :
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