SMT solder joint´s shape and location optimization using genetic algorithm with neural networks in high acceleration condition

There have many papers in shape optimization of comparatively poor in adaptability to environment and in SMT solder joint. But there have little paper to consider location optimization of SMT solder joint. And in dynamic high acceleration load, the location of SMT solder joint is so important that can impact its reliability and lifetime seriously. In this paper, SMT solder joint´s shape and location optimization using neural network based on genetic algorithm in dynamic high acceleration load is considered and some satisfactory results are obtained. Among the optimization, there is a fact that the location of solder joint is the first factor under mechanical condition while under thermal condition, the shape of solder joint is the first factor to reliability of solder joint.