• DocumentCode
    3203532
  • Title

    Texturing Mechanism of Si using Hydrogen Radicals

  • Author

    Nagayoshi, Hiroshi ; Nishimura, Suzuka ; Terashima, Kazutaka ; Ulyashin, Alexander

  • Author_Institution
    Tokyo Nat. Coll. of Technol.
  • Volume
    2
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    1411
  • Lastpage
    1414
  • Abstract
    A new way of inverted pyramid or labyrinth V groove texture fabrication on the polished silicon surface by the hot filament method is proposed. The assist of mesh like particle layer deposition, which works as an etching mask against hydrogen radical, enables the fabrication of surface texture. The particles were not deposited as mesh like pattern when the SiO2/Si substrate was used. In addition, the particle deposition pattern depended on the substrate area size and the distance between the substrate and the filament. The results suggest that the evaporation of silicon hydrides from the silicon surface has an important role to generate the particles and mesh-like particle pattern. The surface texturization of the EFG ribbon wafers and as cut CZ wafers were examined
  • Keywords
    elemental semiconductors; etching; silicon; surface texture; CZ wafers; EFG ribbon wafers; Si; SiO2-Si; etching mask; evaporation; hot filament; hydrogen radicals; inverted pyramid texture fabrication; labyrinth V groove texture fabrication; mesh-like particle pattern; particle deposition pattern; polished silicon surface; silicon hydrides; surface texture fabrication; surface texturization; texturing mechanism; Crystallization; Etching; Hydrogen; Materials science and technology; Rough surfaces; Silicon; Surface roughness; Surface texture; Surface treatment; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279716
  • Filename
    4059911