DocumentCode
3203532
Title
Texturing Mechanism of Si using Hydrogen Radicals
Author
Nagayoshi, Hiroshi ; Nishimura, Suzuka ; Terashima, Kazutaka ; Ulyashin, Alexander
Author_Institution
Tokyo Nat. Coll. of Technol.
Volume
2
fYear
2006
fDate
38838
Firstpage
1411
Lastpage
1414
Abstract
A new way of inverted pyramid or labyrinth V groove texture fabrication on the polished silicon surface by the hot filament method is proposed. The assist of mesh like particle layer deposition, which works as an etching mask against hydrogen radical, enables the fabrication of surface texture. The particles were not deposited as mesh like pattern when the SiO2/Si substrate was used. In addition, the particle deposition pattern depended on the substrate area size and the distance between the substrate and the filament. The results suggest that the evaporation of silicon hydrides from the silicon surface has an important role to generate the particles and mesh-like particle pattern. The surface texturization of the EFG ribbon wafers and as cut CZ wafers were examined
Keywords
elemental semiconductors; etching; silicon; surface texture; CZ wafers; EFG ribbon wafers; Si; SiO2-Si; etching mask; evaporation; hot filament; hydrogen radicals; inverted pyramid texture fabrication; labyrinth V groove texture fabrication; mesh-like particle pattern; particle deposition pattern; polished silicon surface; silicon hydrides; surface texture fabrication; surface texturization; texturing mechanism; Crystallization; Etching; Hydrogen; Materials science and technology; Rough surfaces; Silicon; Surface roughness; Surface texture; Surface treatment; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location
Waikoloa, HI
Print_ISBN
1-4244-0017-1
Electronic_ISBN
1-4244-0017-1
Type
conf
DOI
10.1109/WCPEC.2006.279716
Filename
4059911
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