DocumentCode :
3203859
Title :
Functional simulation of the cochlea for implant optimization
Author :
Ceresa, Mario ; Perez, Federico ; Vera, S. ; Carranza, Noemi ; Herrero Jover, Javier ; Mistrik, Pavel ; Gonzalez Ballester, Miguel A.
Author_Institution :
Alma IT Syst., Barcelona, Spain
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
4541
Lastpage :
4544
Abstract :
Cochlear implantation is a surgical technique which aims to restore hearing in people with deep hearing loss. However, outcomes of the surgery still exhibit a large variability between patients. Among the factors that contribute to variability the most important are morphological differences in anatomical structures between patients and incorrect implant placements. In order to address these issues, it would be desirable to have a functional model of the cochlea which incorporates inter-patients variability and simulate electrode placement. To this end, we present a finite element model which captures the interaction between the cochlear partition, modeled as an elastic solid with finite deformation, and the perilymph fluid, modeled as a compressible, viscous fluid. Numerical results show that the membrane responds to changes in the stimulation frequencies.
Keywords :
biomechanics; cochlear implants; deformation; ear; elasticity; finite element analysis; medical disorders; physiological models; anatomical structures; cochlea functional model; cochlea functional simulation; cochlear implant optimization; cochlear partition; compressible viscous fluid; deep hearing loss; elastic solid deformation; electrode placement; finite element model; hearing restoration; implant placement; interpatient variability; perilymph fluid; surgery; Auditory system; Equations; Mathematical model; Solid modeling; Solids; Tensile stress; Elmer; FEM; cochlear partition; fluid-structure interaction; perilymph;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610557
Filename :
6610557
Link To Document :
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