Title :
Extreme temperature (-170°C to +125°C) electronics for nanorover operation
Author :
Newell, Michael A. ; Stern, Ryan ; Hykes, David ; Bolotin, Gary ; Gregoire, Tim ; Mccarthy, Thomas ; Buchanan, Christen ; Cozy, Scott
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
The design of the electronics control and data system for the extreme environment seen by a 1.3 kg, 1666 cubic cm nanorover is presented. The Muses-CN electronics is a low mass, low volume, low power electronics platform that must operate over the -170°C to +125°C temperature range and a 1 AU free space radiation environment. The nanorover electronics is a 2.5 W system that allows for 0.05 to 1 MIPS processing power and will control 10 motors for mobility and science instruments. Science measurements include IR and Alpha Xray backscatter spectrometers along with an active pixel sensor camera and robotic telemetry signals. The theoretical basis for a low power electronics system with space and commercial grade electronics parts operating in this temperature range is presented. System and component temperature results along with the unique packaging constraints of the COB assembly are also discussed
Keywords :
CMOS analogue integrated circuits; CMOS logic circuits; aerospace computing; aerospace robotics; chip-on-board packaging; cryogenic electronics; flip-flops; high-temperature electronics; invertors; low-power electronics; operational amplifiers; planetary rovers; power MOSFET; space vehicle electronics; telerobotics; -170 to 125 C; 0.05 to 1 MIPS; 1.3 kg; 2.5 W; CMOS invertor; COB assembly; Muses-CN electronics; commercial grade electronics; electronics control and data system; extreme temperature electronics; flip flop; free space radiation environment; low power electronics platform; nanorover operation; op amp; packaging constraints; power MOSFET; robotic telemetry; space grade electronics; Backscatter; Control systems; Data systems; Gold; Instruments; Low power electronics; Micromotors; Spectroscopy; Temperature distribution; Temperature sensors;
Conference_Titel :
Aerospace Conference, 2001, IEEE Proceedings.
Conference_Location :
Big Sky, MT
Print_ISBN :
0-7803-6599-2
DOI :
10.1109/AERO.2001.931205
