• DocumentCode
    3203963
  • Title

    High voltage photoconductive switches using semi-insulating, vanadium doped 6H-SiC

  • Author

    James, C. ; Hettler, C. ; Dickens, J.

  • Author_Institution
    Center for Pulsed Power & Power Electron., Texas Tech Univ., Lubbock, TX, USA
  • fYear
    2009
  • fDate
    June 28 2009-July 2 2009
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    SiC manufacturers are continually improving the purity of their wafers, however, interband impurities, while detrimental in many applications, can be useful in the operation of photoconductive switches. Compact, high-voltage photoconductive switches were fabricated using c-plane; vanadium doped 6H-SiC obtained from II-VI, Inc. This material incorporates a large amount of interband impurities that are compensated by the vanadium amphoteric, but at present is only available as c-plane wafers. In order to avoid micropipe defects, lateral switches were fabricated to allow validation of material simulations. Low resistivity contacts were formed on the semi-insulating material and a high-voltage encapsulant increases the surface flashover potential of the switch. Material characteristics were determined and switch parameters were simulated with comparisons made to experimental data.
  • Keywords
    contact resistance; flashover; photoconducting switches; silicon compounds; vanadium; wide band gap semiconductors; SiC:V; c-plane wafers; high voltage photoconductive switches; high-voltage encapsulant; interband impurities; low resistivity contacts; micropipe defects; semiinsulating vanadium doped materials; surface flashover potential; switch parameters; vanadium amphoteric; Conductivity; Contacts; Impurities; Manufacturing; Photoconducting materials; Photoconductivity; Semiconductor materials; Silicon carbide; Switches; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Conference, 2009. PPC '09. IEEE
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-4064-1
  • Electronic_ISBN
    978-1-4244-4065-8
  • Type

    conf

  • DOI
    10.1109/PPC.2009.5386303
  • Filename
    5386303