DocumentCode :
3204431
Title :
Low-temperature germanium ultra-high vacuum chemical vapor deposition for back-end photonic device integration
Author :
McComber, Kevin A. ; Liu, Jifeng ; Michel, Jurgen ; Kimerling, Lionel C.
Author_Institution :
Dept. of Mater. Sci. & Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2010
fDate :
1-3 Sept. 2010
Firstpage :
57
Lastpage :
59
Abstract :
This work demonstrates single-crystal germanium deposited by ultra-high vacuum chemical vapor deposition (UHVCVD) on amorphous silicon (a-Si), with all processing performed at temperatures below 450°C. This material shows promise for the successful backend fabrication of photonic devices.
Keywords :
chemical vapour deposition; germanium; integrated optics; amorphous silicon; back-end photonic device integration; low-temperature germanium ultra-high vacuum; temperature 450 degC; ultra-high vacuum chemical vapor deposition; Fabrication; Germanium; Photodetectors; Photonics; Silicon; Substrates; Single-crystal germanium; UHVCVD; geometrically-confined lateral growth; grain engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Group IV Photonics (GFP), 2010 7th IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-6344-2
Type :
conf
DOI :
10.1109/GROUP4.2010.5643429
Filename :
5643429
Link To Document :
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