• DocumentCode
    3204466
  • Title

    Electric field distributions in the cross-sections of the SiC hollow-core waveguides

  • Author

    Asmontas, S. ; Nickelson, L. ; Gric, T. ; Martavicius, R.

  • Author_Institution
    Semicond. Phys. Inst., Vilnius, Lithuania
  • fYear
    2009
  • fDate
    June 28 2009-July 2 2009
  • Firstpage
    507
  • Lastpage
    510
  • Abstract
    The SiC material can be used in wide area of applications. Silicon is the material that dominates in the electronics industry today. A change of technology from silicon to silicon carbide is going to revolutionize the power electronics. So the SiC power devices are beginning to be commercialized nowadays. Hollow-core (HC) waveguides have excellent properties. For instance, HC waveguides can be used for high power lasers, no end reflections and small beam divergence. We have investigated a hollow-core cylindrical SiC waveguide. The investigations were made at different temperatures. The permittivity of the SiC material depends on the temperature. The values of temperatures were taken from the study conducted by T. A. Baeraky (2002). We have calculated the dispersion characteristics and the electric field distributions of the hollow-core SiC waveguide with radius r = 1 mm. It should be accented that all our calculations were made taking into account waveguide material losses.
  • Keywords
    circular waveguides; dielectric losses; dielectric waveguides; permittivity; silicon compounds; wide band gap semiconductors; SiC; cylindrical hollow-core waveguides; dispersion characteristics; electric field distributions; electronics industry; high power lasers; material losses; permittivity; power devices; power electronics; reflections; silicon carbide materials; small beam divergence; Commercialization; Conducting materials; Electronics industry; Laser beams; Optical reflection; Power electronics; Power lasers; Silicon carbide; Temperature; Waveguide lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Conference, 2009. PPC '09. IEEE
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-4064-1
  • Electronic_ISBN
    978-1-4244-4065-8
  • Type

    conf

  • DOI
    10.1109/PPC.2009.5386329
  • Filename
    5386329