Title :
200mm wafer scale III-V/SOI technology for all-optical network-on-chip and signal processing
Author :
Liu, Liu ; Spuesens, Thijs ; Van Thourhout, Dries ; Morthier, Geert ; Grenouillet, Laurent ; Olivier, Nicolas ; Fedeli, Jean-Marc ; Rojo-Romeo, Pedro ; Régreny, Philippe ; Mandorlo, Fabien ; Orobtchouk, Regis
Author_Institution :
INTEC Dept., Ghent Univ.-IMEC, Ghent, Belgium
Abstract :
Integrated components, including microdisk lasers, photodetectors, and wavelength selective circuits, for optical network-on-chip and all-optical signal processing are presented using a complementary metal-oxide-semiconductor compatible III-V/silicon-on-insulator integration technology at 200mm wafer scale.
Keywords :
CMOS integrated circuits; III-V semiconductors; integrated optics; microdisc lasers; network-on-chip; optical information processing; photodetectors; silicon-on-insulator; wafer bonding; wafer-scale integration; III-V-silicon-on-insulator integration technology; Si; all-optical network-on-chip; complementary metal-oxide-semiconductor; integrated components; microdisk lasers; optical signal processing; photodetectors; size 200 mm; wafer scale III-V-SOI technology; wavelength selective circuits; Bonding; CMOS integrated circuits; Optical device fabrication; Optical filters; Optical waveguides; Photonics; Waveguide lasers; flip-flop; heterogeneous integration; microdisk laser; network-on-chip; silicon-on-insulator;
Conference_Titel :
Group IV Photonics (GFP), 2010 7th IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-6344-2
DOI :
10.1109/GROUP4.2010.5643444
