DocumentCode :
3205056
Title :
Effects of the hydrogen plasma treatment on the thin-film polycrystalline SiGe
Author :
Honda, Daisuke ; Nakamura, Isao ; Isomura, Masao
Author_Institution :
Dept. of Electr. & Electron. Eng., Tokai Univ., Kanagawa
Volume :
2
fYear :
2006
fDate :
38838
Firstpage :
1688
Lastpage :
1691
Abstract :
We have investigated the hydrogen plasma treatment of thin-film polycrystalline SiGe with 65 % Ge content. The amorphous SiGe films were prepared at 200degC by a radio-frequency (RF) magnetron sputtering system and then crystallized by solid phase crystallization at 580degC. The hydrogen plasma treatment was done by an inductively-coupled RF plasma and RF bias voltage applied to the substrate. The dark conductivity and the absorption coefficients corresponding to energy gaps were decreased by the hydrogen plasma treatment. The best conditions were 300degC and 10 Pa-15 Pa with the proper RF bias voltage. The results suggest that the hydrogen plasma treatment is effective to reduce the dangling bond defects in the polycrystalline SiGe thin films
Keywords :
Ge-Si alloys; amorphous semiconductors; crystallisation; dangling bonds; dark conductivity; energy gap; plasma materials processing; semiconductor materials; semiconductor thin films; sputter deposition; 10 to 15 Pa; 200 C; 300 C; 580 C; SiGe; absorption coefficients; amorphous films; dangling bond defects; dark conductivity; energy gaps; hydrogen plasma treatment; inductively-coupled radio-frequency plasma; radio-frequency bias voltage; radio-frequency magnetron sputtering system; solid phase crystallization; thin-film polycrystalline materials; Amorphous materials; Crystallization; Germanium silicon alloys; Hydrogen; Plasmas; Radio frequency; Silicon germanium; Sputtering; Transistors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
Type :
conf
DOI :
10.1109/WCPEC.2006.279815
Filename :
4059981
Link To Document :
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