Title :
Analysis of densely packed microstrip interconnects
Author :
Lin, Chien-Min ; Chan, Chi Hou
Author_Institution :
Dept. of Electron. Eng., City Univ., Hong Kong
Abstract :
An iterative technique for analyzing the large-scale microstrip interconnect problems is presented in this paper. It entails the use of the RWG triangular discretization for modeling flexibility and the complex image method and FFT for numerical efficiency. Examples of complicated microstrip interconnect configurations are presented
Keywords :
fast Fourier transforms; integrated circuit interconnections; iterative methods; microstrip circuits; microstrip lines; packaging; sparse matrices; FFT; RWG triangular discretization; complex image method; densely packed microstrip interconnects; electronic packaging; iterative technique; large-scale microstrip interconnect problems; Electromagnetic analysis; Electronics packaging; Green´s function methods; Impedance; Integrated circuit interconnections; Large-scale systems; Matrix decomposition; Microstrip; Sparse matrices; Transmission line matrix methods;
Conference_Titel :
Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific
Print_ISBN :
962-442-117-X
DOI :
10.1109/APMC.1997.654673
