DocumentCode :
3205974
Title :
GaAs Photovoltaics on Polycrystalline Ge Substrates
Author :
Wilt, David M. ; Smith, Mark A. ; Maurer, William ; Scheiman, David ; Jenkins, Phillip P.
Author_Institution :
NASA Glenn Res. Center, Cleveland, OH
Volume :
2
fYear :
2006
fDate :
38838
Firstpage :
1891
Lastpage :
1894
Abstract :
High efficiency III-V multijunction solar cells deposited on metal foil or even polymer substrates can provide tremendous advantages in mass and stowage, particularly for planetary missions. As a first step towards that goal, polycrystalline p/i/n gallium arsenide (GaAs) solar cells are under development on bulk polycrystalline germanium (Ge) substrates. Single junction p/i/n GaAs photovoltaic devices, incorporating indium gallium phosphide (InGaP) front and back window layers, have been grown and processed. Device performance has shown a dependence upon the thickness of a GaAs buffer layer. An unintentional Ge subjunction was formed in the initial devices and limited the efficiency to ~13% (estimated with an antireflection coating) due to the current mismatch and lack of tunnel junction interconnect. Work is underway to control the Ge junction formation and extend the development to polycrystalline InGaP devices
Keywords :
III-V semiconductors; antireflection coatings; buffer layers; gallium arsenide; gallium compounds; indium compounds; semiconductor junctions; solar cells; GaAs-InGaP; Ge; III-V multijunction solar cells; antireflection coating; buffer layer; indium gallium phosphide window layers; metal foil; photovoltaic devices; planetary missions; polycrystalline devices; polycrystalline germanium substrates; polycrystalline p-i-n gallium arsenide solar cells; polymer substrates; tunnel junction interconnect; Crystalline materials; Dark current; Gallium arsenide; Grain boundaries; Grain size; III-V semiconductor materials; Photovoltaic cells; Polymers; Substrates; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
Type :
conf
DOI :
10.1109/WCPEC.2006.279865
Filename :
4060031
Link To Document :
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