DocumentCode :
3206215
Title :
Energy optimization for current-mode signaling in high-speed on-chip interconnects
Author :
Irfansyah, Astria Nur ; Lehmann, Torsten ; Nooshabadi, Saeid
Author_Institution :
Sch. of Electr. Eng. & Telecommun., Univ. of New South Wales, Kensington, NSW
fYear :
2007
fDate :
25-28 Nov. 2007
Firstpage :
1306
Lastpage :
1311
Abstract :
This paper studies the energy-optimization design methodology for current-mode (CM) signaling in high-speed on-chip interconnects, using the modified clamped bit-line sense amplifier circuit (MCBLSA) as a case study. Optimization for the CM circuits for on-chip interconnects requires a completely different treatment than the voltage-mode circuits, due to the problems such as different effective driver resistance and termination resistance modeling. The methodology was validated using SPICE simulations. It is shown that when dealing with receiver termination sizing, the optimal size is determined by the required voltage swing at the receiver end to guarantee valid operation under the effect of crosstalk noise. However, sizing the driver and receiver transistors should be done simultaneously as their resistive values which affect the performance are dependent on each other.
Keywords :
SPICE; current-mode circuits; integrated circuit interconnections; transistor circuits; SPICE simulations; crosstalk noise; current-mode signaling; driver transistors; energy-optimization design methodology; high-speed on-chip interconnects; modified clamped bit-line sense amplifier circuit; receiver transistors; Circuit simulation; Driver circuits; Impedance; Integrated circuit interconnections; Inverters; Power dissipation; SPICE; Signal design; System-on-a-chip; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent and Advanced Systems, 2007. ICIAS 2007. International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-1355-3
Electronic_ISBN :
978-1-4244-1356-0
Type :
conf
DOI :
10.1109/ICIAS.2007.4658596
Filename :
4658596
Link To Document :
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