DocumentCode
3206614
Title
A 3–5 GHz LNA in 0.25µm SOI CMOS process for implantable WBANs
Author
Iji, Ayobami ; Zhu, Xi ; Heim, Michael
Author_Institution
Dept. of Electron. Eng., Macquarie Univ., Sydney, NSW, Australia
fYear
2012
fDate
5-8 Aug. 2012
Firstpage
766
Lastpage
769
Abstract
A low-voltage, low-power single-ended LNA is implemented in a 0.25 μm SOI CMOS technology. A theoretical basis for the design is used to develop design constraints in conjunction with a layout-aware design flow providing early insight into parasitic effects. The SOI CMOS LNA has a post-layout simulated noise figure of less than 3 dB; input IP3 of -10 dBm and small-signal gain of 19.2 dB within the 3-5 GHz band. Total current consumption is 5.2 mA from 1.5 V supply voltage. The LNA can also operate under a 1V supply voltage with relatively small linear performance degradation. The chip area is 0.89 mm2. Due to the high-resistivity silicon substrate, buried oxide isolation and low threshold voltage, the SOI CMOS technology offers significant performance improvements for LNAs, which makes the designed LNA well suitable for implantable WBANs.
Keywords
CMOS integrated circuits; body area networks; low noise amplifiers; silicon-on-insulator; SOI CMOS LNA; SOI CMOS process; SOI CMOS technology; buried oxide isolation; current 5.2 mA; frequency 3 GHz to 5 GHz; gain 19.2 dB; high resistivity silicon substrate; implantable WBAN; layout aware design flow; linear performance degradation; low power single ended LNA; post layout simulated noise figure; size 0.25 mum; supply voltage; voltage 1 V; voltage 1.5 V; CMOS integrated circuits; CMOS process; Noise measurement; Scattering parameters; Wideband; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (MWSCAS), 2012 IEEE 55th International Midwest Symposium on
Conference_Location
Boise, ID
ISSN
1548-3746
Print_ISBN
978-1-4673-2526-4
Electronic_ISBN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2012.6292133
Filename
6292133
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