Accurate CAD model for computation of input impedance of equilateral triangular patch antenna on suspended and composite substrates

Author

Dam, Mads ; Mazumder, S. ; Biswas, Mukul

Author_Institution

Dept. of Electron. & Commun. Eng., Hooghly Eng. & Technol. Coll., Hooghly, India

fYear

2013

fDate

13-15 Dec. 2013

Firstpage

1

Lastpage

4

Abstract

A set of closed form expressions based on cavity model are proposed to investigate the effect of composite and suspended substrate on the input impedance of an equilateral triangular patch antenna (ETPA). The proposed model has been validated employing standard commercial software (HFSS). A comparison of theoretical values for input impedance of an ETPA with that obtained by simulation (HFSS) reveals close proximity with each other for wide range of permittivity and thickness of composite and suspended substrate. Also the computed value of input impedances of ETPA on single substrate is compared with the measured values available in literature. The comparison result is found to be in close agreement with the available experimental results compared to other models available in literature.

Keywords

CAD; composite materials; microstrip antennas; CAD model; ETPA; cavity model; closed form expression; composite substrate; equilateral triangular patch antenna; input impedance computation; standard HFSS commercial software; suspended substrate; Computational modeling; Impedance; Microstrip; Microstrip antennas; Patch antennas; Solid modeling; Substrates; composite; input impedance; suspended; triangular patch;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Photonics (ICMAP), 2013 International Conference on

Conference_Location

Dhanbad

Print_ISBN

978-1-4799-2176-8

Type

conf

DOI

10.1109/ICMAP.2013.6733489

Filename

6733489