• DocumentCode
    3207159
  • Title

    An Empirical Study of Hear-Through Augmented Reality: Using Bone Conduction to Deliver Spatialized Audio

  • Author

    Lindeman, Robert W. ; Noma, Haruo ; De Barros, Paulo Gonçalves

  • Author_Institution
    Worcester Polytech. Inst., Worcester
  • fYear
    2008
  • fDate
    8-12 March 2008
  • Firstpage
    35
  • Lastpage
    42
  • Abstract
    Augmented reality (AR) is the mixing of computer-generated stimuli with real-world stimuli. In this paper, we present results from a controlled, empirical study comparing three ways of delivering spatialized audio for AR applications: a speaker array, headphones, and a bone-conduction headset. Analogous to optical-see-through AR in the visual domain, hear-through AR allows users to receive computer-generated audio using the bone-conduction headset, and real-world audio using their unoccluded ears. Our results show that subjects achieved the best accuracy using a speaker array physically located around the listener when stationary sounds were played, but that there was no difference in accuracy between the speaker array and the bone-conduction device for sounds that were moving, and that both devices outperformed standard headphones for moving sounds. Subjective comments by subjects following the experiment support this performance data.
  • Keywords
    augmented reality; bone; handicapped aids; headphones; hearing aids; bone conduction; computer-generated stimuli; headphones; hear-through augmented reality; spatialized audio; speaker array; Augmented reality; Bones; Character generation; Ear; Frequency; Headphones; Irrigation; Loudspeakers; Microphones; Virtual reality; Artificial, augmented, and virtual realities; Augmented reality; H.5.1 [Information Interfaces and Presentation]: Multimedia Information Systems-Audio input/output; audio; bone conduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Virtual Reality Conference, 2008. VR '08. IEEE
  • Conference_Location
    Reno, NE
  • Print_ISBN
    978-1-4244-1971-5
  • Electronic_ISBN
    978-1-4244-1972-2
  • Type

    conf

  • DOI
    10.1109/VR.2008.4480747
  • Filename
    4480747