Title :
Developing stimulus presentation on mobile devices for a truly portable SSVEP-based BCI
Author :
Yu-Te Wang ; Yijun Wang ; Chung-kuan Cheng ; Tzyy-Ping Jung
Author_Institution :
Dept. of Comput. Sci. & Eng., Univ. of California San Diego (UCSD), La Jolla, CA, USA
Abstract :
This study integrates visual stimulus presentation and near real-time data processing on a mobile device (e.g. a Tablet or a cell-phone) to implement a steady-state visual evoked potentials (SSVEP)-based brain-computer interface (BCI). The goal of this study is to increase the practicability, portability and ubiquity of an SSVEP-based BCI for daily use. The accuracy of flickering frequencies on the mobile SSVEP BCI system was tested against that on a laptop/desktop used in our previous studies. This study then analyzed the power spectrum density of the electroencephalogram signals elicited by the visual stimuli rendered on the mobile BCIs. Finally, this study performed an online test with the Tablet-based BCI system and obtained an averaged information transfer rate of 33.87 bits/min in three subjects. The current integration leads to a truly practical and ubiquitous SSVEP BCI on mobile devices for real-life applications.
Keywords :
biomedical communication; brain-computer interfaces; electroencephalography; laptop computers; medical signal detection; medical signal processing; mobile radio; neurophysiology; notebook computers; visual evoked potentials; SSVEP-based BCI portability; SSVEP-based BCI ubiquity; brain-computer interface; cell phone; desktop; electroencephalogram signal analysis; flickering frequency; laptop; mobile device; power spectrum density analysis; real-time data processing; steady-state visual evoked potential; tablet-based BCI system; visual stimulus presentation; Brain-computer interfaces; Electroencephalography; Mobile handsets; Portable computers; Real-time systems; Steady-state; Visualization;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6610738