DocumentCode
3207324
Title
Influence of blood vessel conductivity in cochlear implant stimulation using a finite element head model
Author
Tran, P. ; Wong, Paul ; Sue, Andrian ; Qing Li ; Carter, Paul
Author_Institution
Sch. of Aerosp., Mech. & Mechatron. Eng., Univ. of Sydney, Sydney, NSW, Australia
fYear
2013
fDate
3-7 July 2013
Firstpage
5291
Lastpage
5294
Abstract
It is known that the inclusion of blood vessels in finite element (FE) models can influence the current conduction results. However, there have been no studies exploring the impact of blood vessel conductivity on human head models for cochlear implant (CI) stimulation. The three-dimensional (3D) FE model presented in this paper aims to provide understanding in this regard. The electrical conductivity of blood was varied to determine the sensitivity of the 3D model. The results show that some of the current is exiting the cochlea and taking the jugular vein pathway. When compared to the case with blood vessels being omitted, the current density in the blood increased by 13.1%, 17.2% and 20.7% for low, medium and high electrical conductivity cases considered, respectively. This study suggests that blood vessels cannot be neglected from CI models as the jugular vein can provide a low impedance pathway, through which current can leave the cochlea. It also indicates the importance of using correct tissue property values for performing accurate bioelectric modeling analyses.
Keywords
bioelectric phenomena; blood; blood vessels; cochlear implants; electrical conductivity; finite element analysis; neurophysiology; physiological models; 3D finite element model; 3D model sensitivity; bioelectric modeling; blood electrical conductivity; blood vessel conductivity effects; cochlear implant stimulation; current conduction; finite element head model; human head models; jugular vein; Blood; Brain modeling; Conductivity; Current density; Electrodes; Head;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6610743
Filename
6610743
Link To Document