• DocumentCode
    3207324
  • Title

    Influence of blood vessel conductivity in cochlear implant stimulation using a finite element head model

  • Author

    Tran, P. ; Wong, Paul ; Sue, Andrian ; Qing Li ; Carter, Paul

  • Author_Institution
    Sch. of Aerosp., Mech. & Mechatron. Eng., Univ. of Sydney, Sydney, NSW, Australia
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    5291
  • Lastpage
    5294
  • Abstract
    It is known that the inclusion of blood vessels in finite element (FE) models can influence the current conduction results. However, there have been no studies exploring the impact of blood vessel conductivity on human head models for cochlear implant (CI) stimulation. The three-dimensional (3D) FE model presented in this paper aims to provide understanding in this regard. The electrical conductivity of blood was varied to determine the sensitivity of the 3D model. The results show that some of the current is exiting the cochlea and taking the jugular vein pathway. When compared to the case with blood vessels being omitted, the current density in the blood increased by 13.1%, 17.2% and 20.7% for low, medium and high electrical conductivity cases considered, respectively. This study suggests that blood vessels cannot be neglected from CI models as the jugular vein can provide a low impedance pathway, through which current can leave the cochlea. It also indicates the importance of using correct tissue property values for performing accurate bioelectric modeling analyses.
  • Keywords
    bioelectric phenomena; blood; blood vessels; cochlear implants; electrical conductivity; finite element analysis; neurophysiology; physiological models; 3D finite element model; 3D model sensitivity; bioelectric modeling; blood electrical conductivity; blood vessel conductivity effects; cochlear implant stimulation; current conduction; finite element head model; human head models; jugular vein; Blood; Brain modeling; Conductivity; Current density; Electrodes; Head;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6610743
  • Filename
    6610743