• DocumentCode
    320821
  • Title

    MCM interconnect design using two-pole approximation

  • Author

    Shao, Jianhua ; Chen, Richard M M

  • Author_Institution
    Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
  • fYear
    1998
  • fDate
    23-26 Feb 1998
  • Firstpage
    544
  • Lastpage
    548
  • Abstract
    In this paper, an optimization scheme is proposed for interconnect design with wire width and series resistance being design variables. Due to the distributed nature of interconnects, poles of such systems are transcendental and infinite in number. First, a two-pole approximation is used to capture the system behavior. Lower-order moments are employed to obtain two approximate dominant poles. Then, the two parameters, damping ratio and natural undamped frequency, are expressed as functions of the two dominant poles. Since the output response is characterized by the two parameters, the parameters are used to define the objective function and constraints, which form a constrained multivariable nonlinear optimization problem. After that, the optimization problem is solved using the gradient projection method. One advantage of our approach is the ability to explicitly control the maximum overshoot of the observation points. Two numerical examples are given
  • Keywords
    approximation theory; circuit optimisation; electric resistance; integrated circuit interconnections; multichip modules; poles and zeros; MCM interconnect design; constrained multivariable nonlinear optimization problem; damping ratio; gradient projection method; lower-order moments; natural undamped frequency; objective function; optimization scheme; series resistance; two-pole approximation; wire width; Constraint optimization; Damping; Delay; Design engineering; Design optimization; Frequency; Inductance; Optimization methods; Tellurium; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 1998., Proceedings
  • Conference_Location
    Paris
  • Print_ISBN
    0-8186-8359-7
  • Type

    conf

  • DOI
    10.1109/DATE.1998.655911
  • Filename
    655911