Title :
High performance underfills development - materials, processes, and reliability
Author :
Nguyen, L. ; Hoang, L. ; Fine, P. ; Shi, S. ; Vincent, M. ; Wang, L. ; Wong, C.P. ; Tong, Q. ; Ma, B. ; Humphreys, R. ; Savoca, A.
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
Abstract :
The typical underfill enhances the solder life of flip chip structures by up to an order of magnitude. With increasing packaging applications requiring flip chip interconnection, much industry interest has been devoted to the development of better underfill materials, which are more cost-effective and provide better performance than current commercial materials. This paper presents the highlights of a recent DARPA-funded program to develop new underfill materials for low-cost flip chip applications
Keywords :
assembling; circuit reliability; encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; polymer films; soldering; cost-effectiveness; flip chip applications; flip chip interconnection; flip chip structures; packaging applications; solder life; underfill; underfill development; underfill materials; underfill processes; underfill reliability; Assembly; Chemical technology; Curing; Flip chip; Large scale integration; Materials reliability; Resins; Semiconductor materials; Temperature; Testing;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656503
