DocumentCode :
3209204
Title :
Interconnections in multi-core architectures: understanding mechanisms, overheads and scaling
Author :
Kumar, Rakesh ; Zyuban, Victor ; Tullsen, Dean M.
Author_Institution :
Dept. of Comput. Sci. & Eng., California Univ., San Diego, CA, USA
fYear :
2005
fDate :
4-8 June 2005
Firstpage :
408
Lastpage :
419
Abstract :
This paper examines the area, power, performance, and design issues for the on-chip interconnects on a chip multiprocessor, attempting to present a comprehensive view of a class of interconnect architectures. It shows that the design choices for the interconnect have significant effect on the rest of the chip, potentially consuming a significant fraction of the real estate and power budget. This research shows that designs that treat interconnect as an entity that can be independently architected and optimized would not arrive at the best multi-core design. Several examples are presented showing the need for careful co-design. For instance, increasing interconnect bandwidth requires area that then constrains the number of cores or cache sizes, and does not necessarily increase performance. Also, shared level-2 caches become significantly less attractive when the overhead of the resulting crossbar is accounted for. A hierarchical bus structure is examined which negates some of the performance costs of the assumed base-line architecture.
Keywords :
cache storage; microprocessor chips; multiprocessor interconnection networks; parallel architectures; performance evaluation; system buses; chip multiprocessor; hierarchical bus structure; interconnect architectures; interconnect bandwidth; interconnections; multicore architectures; multicore design; on-chip interconnects; Bandwidth; Computer architecture; Computer science; Delay; Design engineering; Joining processes; Power engineering and energy; Power system interconnection; Space exploration; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Architecture, 2005. ISCA '05. Proceedings. 32nd International Symposium on
ISSN :
1063-6897
Print_ISBN :
0-7695-2270-X
Type :
conf
DOI :
10.1109/ISCA.2005.34
Filename :
1431574
Link To Document :
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