• DocumentCode
    3209373
  • Title

    The thermal efficiency of cabinets cooled by natural convection

  • Author

    Malhammar, A.

  • Author_Institution
    Ericsson Telecom, Stockholm
  • fYear
    1988
  • fDate
    30 Oct-2 Nov 1988
  • Firstpage
    339
  • Lastpage
    343
  • Abstract
    The latest development in natural convection theory has made it possible to predict the heat transfer coefficient for cases where an air channel, a `chimney´, is located above parallel warm plates. If this theory is applied to a cabinet filled with printed circuit boards (PCBs), it is possible to define three thermal quantities: the thermal efficiency, the heat area ratio, and the surface heat load ratio. If cabinets with different approaches in the thermal design, such as serial and parallel cooling, are compared, it is found that the thermal efficiency is about the same. The surface heat load ratio is, however, superior for the parallel cooling approach, making it suitable for PCBs with high heat loads
  • Keywords
    convection; cooling; packaging; printed circuits; air channel; cooling; heat area ratio; heat transfer coefficient; natural convection; parallel warm plates; printed circuit boards; surface heat load ratio; thermal efficiency; Difference equations; Electronic equipment; Electronics cooling; Geometry; Heat transfer; Telecommunications; Temperature dependence; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference, 1988. INTELEC '88., 10th International
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/INTLEC.1988.22372
  • Filename
    22372