DocumentCode
320944
Title
Thermal management of electronics enclosures under unsteady heating/cooling conditions using phase change materials (PCM)
Author
Marongiu, Maurice J. ; Clarksean, Randy
Author_Institution
MJM Eng. Co., Naperville, IL, USA
Volume
3
fYear
1997
fDate
27 Jul-1 Aug 1997
Firstpage
1865
Abstract
This paper describes work on the design and development of a phase-changing materials (PCM) heat exchanger that will actively (using air movers) store energy during high load periods and release it during low load periods. These heat exchangers are to be made of an aluminum tube bundles in which encapsulated PCM materials (such as salts, wax, etc.) are included. Air is made to flow through the heat exchanger during power on conditions in order for the PCM to change phase; later, during power off conditions, outside air is used to remove the heat from the heat exchanger. Preliminary results indicate very favorably that PCM heat exchangers work relatively well in maintaining target temperatures. Furthermore, flow and heat transfer characteristics appear to be well predicted by the modeling of the heat exchangers
Keywords
cooling; heat exchangers; heat sinks; packaging; thermal energy storage; aluminum tube bundles; electronics enclosures; encapsulated PCM materials; flow characteristics; heat energy storage; heat exchanger; heat removal; heat transfer characteristics; phase change materials; power off conditions; power on conditions; target temperature; thermal management; Electronics cooling; Energy storage; Heat transfer; Heating; Humidity; Phase change materials; Power system management; Temperature; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
Conference_Location
Honolulu, HI
Print_ISBN
0-7803-4515-0
Type
conf
DOI
10.1109/IECEC.1997.656708
Filename
656708
Link To Document