Title :
RDL manufacturing for flip chip packaging
Author :
Williams, Brett ; Florence, Deborah ; Dalai, H. ; Gunturu, Krishna ; Nelson, Mark ; Belisle, Chuck
Author_Institution :
AMI Semicond., Inc., Pocatello, ID
Abstract :
The RDL processing module provides an interconnect redistribution layer (RDL) used in flip chip packaging. The processing of this RDL module is explained in detail along with the design rules used RDL processing is shown to be very robust both structurally and electrically. This technique is compared with the industry to show the unique benefits of the AMIS methodology
Keywords :
chip scale packaging; flip-chip devices; integrated circuit interconnections; integrated circuit manufacture; RDL manufacturing; aluminum conductors; flip chip packaging; integrated circuit interconnections; interconnect redistribution layer; Aluminum; Ambient intelligence; Flip chip; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Passivation; Semiconductor device packaging; Sputter etching; Substrates;
Conference_Titel :
Microelectronics and Electron Devices, 2005. WMED '05. 2005 IEEE Workshop on
Conference_Location :
Boise, ID
Print_ISBN :
0-7803-9072-5
DOI :
10.1109/WMED.2005.1431607
