Title : 
Computer-aided engineering (CAE) applications in semiconductor device manufacturing and reliability
         
        
            Author : 
Groothuis, Steven ; Meade, Roy
         
        
            Author_Institution : 
Assembly & Packaging, Micron Technol. Texas, LLC, Allen, TX
         
        
        
        
        
        
            Abstract : 
With the ever increasing complexity of semiconductor device designs, the need for designed-in manufacturability and reliability continues to present a challenge for successful semiconductor product introduction. Technology computer-aided design (TCAD) software tools provide the needed device physics simulations for both functional and performance requirements. However, an innovative approach of using both TCAD tools and computer-aided engineering (CAE) simulation tools (e.g., used in other areas of physics and mechanical engineering) can provide a comprehensive solution to wafer fabrication and device reliability efforts
         
        
            Keywords : 
circuit CAD; circuit simulation; design for manufacture; semiconductor device manufacture; semiconductor device reliability; technology CAD (electronics); BEOL; CAE simulation tools; FEOL; TCAD software tools; computer-aided engineering; device physics simulations; semiconductor device manufacturing; semiconductor device reliability; semiconductor product introduction; wafer fabrication; Application software; Computational modeling; Computer aided engineering; Computer aided manufacturing; Computer applications; Physics; Reliability engineering; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor devices;
         
        
        
        
            Conference_Titel : 
Microelectronics and Electron Devices, 2005. WMED '05. 2005 IEEE Workshop on
         
        
            Conference_Location : 
Boise, ID
         
        
            Print_ISBN : 
0-7803-9072-5
         
        
        
            DOI : 
10.1109/WMED.2005.1431614