Title :
Improved layer assignment for packaging multichip modules
Author :
Chen, Cheng-Hsi ; Heydari, Mohammad H. ; Tollis, Ioannis G. ; Xia, Chunliang
Author_Institution :
Dept. of Comput. Sci., Texas Univ., Dallas, Richardson, TX, USA
Abstract :
The layer assignment problem plays an important role in packaging multichip modules, since the number of layers is directly related to the cost of the final product. In this paper, the authors propose a new model for the problem and a heuristic layer assignment algorithm based on the new model. The experimental results presented show that the solution provided by the algorithm is close to the lower bound
Keywords :
multichip modules; network routing; packaging; cost; heuristic layer assignment algorithm; layer assignment; lower bound; packaging multichip modules; Computer science; Costs; Electronics industry; Heuristic algorithms; Lead compounds; Multichip modules; Packaging machines; Semiconductor device manufacture; Semiconductor device packaging; Upper bound;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 1992. Proceedings., 1992 IEEE International Workshop on
Conference_Location :
Dallas, TX
Print_ISBN :
0-8186-2837-5
DOI :
10.1109/DFTVS.1992.224343
