DocumentCode
3210520
Title
2004 IEEE International Reliability Physics Symposium. Proceedings (IEEE Cat. No.04CH37533)
fYear
2004
fDate
25-29 April 2004
Abstract
The following topics were discussed: novel transistor reliability findings; transistors; back-end integration; gate dielectrics; latchup; products and circuits; memory; interconnects; MEMS; SER/SEU; back-end dielectrics; failure analysis; ESD; RF products and circuits; compound semiconductors; process integration; assembly and packaging.
Keywords
flip-flops; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; micromechanical devices; semiconductor device packaging; semiconductor device reliability; transistors; ESD; MEMS; RF circuits; RF products; SER/SEU; assembly; back-end dielectrics; back-end integration; compound semiconductors; failure analysis; gate dielectrics; interconnects; latchup; memory; packaging; process integration; products and circuits; transistor reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Conference_Location
Phoenix, AZ, USA
Print_ISBN
0-7803-8315-X
Type
conf
DOI
10.1109/RELPHY.2004.1315284
Filename
1315284
Link To Document