• DocumentCode
    3210889
  • Title

    Capillary/Narrow Flow Channel Driven EHD Gas Pump for an Advanced Thermal Management of Micro-Electronics

  • Author

    Chang, Jen-Shih ; Tsubone, H. ; Harvel, G.D. ; Urashima, K.

  • Author_Institution
    Dept. of Eng. Phys., McMaster Univ., Hamilton, ON
  • fYear
    2008
  • fDate
    5-9 Oct. 2008
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    In order to study the feasibility of applying electrohydrodynamic (EHD) gas pumps for advanced thermal management of micro-electronics, an experimental investigation was conducted to drive gas flow through capillary or narrow flow channel by EHD gas pumps. The net gas flow induced by corona discharge was generated in PF (push fan) type EHD gas pump with and without partially covered corona wire and non-parallel ground plate electrodes to transfer gas through sub-millimeter order circular channels. Therefore, it is important to know the effect of narrow or capillary channel on the characteristics of EHD gas pump with the corona wire electrode covered. The results show that the effects of narrow and capillary circular flow channels significantly influence flow characteristics of PF type EHD gas pump with the corona wire electrode covered under dc positive applied voltage.
  • Keywords
    capillarity; corona; electrohydrodynamics; integrated circuits; microchannel flow; thermal management (packaging); EHD gas pump; capillary narrow flow channel; corona discharge; covered corona wire; electrohydrodynamic gas pumps; microelectronic thermal management; net gas flow; push fan; submillimeter circular channel; Corona; Electrodes; Electrohydrodynamics; Fluid flow; Heat transfer; Pumps; Thermal management; Thermal management of electronics; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 2008. IAS '08. IEEE
  • Conference_Location
    Edmonton, Alta.
  • ISSN
    0197-2618
  • Print_ISBN
    978-1-4244-2278-4
  • Electronic_ISBN
    0197-2618
  • Type

    conf

  • DOI
    10.1109/08IAS.2008.91
  • Filename
    4658879