DocumentCode :
3211431
Title :
Transient-mode multipactor discharge
Author :
Graves, T.P. ; Spektor, S. ; Axley, A.
Author_Institution :
Aerosp. Corp., El Segundo, CA, USA
fYear :
2009
fDate :
1-5 June 2009
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. Multipactor discharge is a resonant condition in which electrons impact material surfaces in phase with an alternating rf or microwave electric field. A growing and/or sustained discharge requires the electrode secondary electron coefficient, delta(Ee), to be greater than unity at the impacting electron energy (Ee). E1, the minimum energy for delta > 1, is highly dependent on electrode surface preparation and conditioning, and contaminated surfaces will generally experience a lower E1 than the same clean or "conditioned" surface. A transient or pulsed mode of multipactor discharge can exist when the rf voltage and the corresponding electron energy distribution occur near E1. Initially, a discharge may form if sufficient number of electrons have impact energies greater than E1. Yet, as surface contaminants are removed with subsequent electron impacts, E1 can quickly increase, causing the electron impact energy to become insufficient for discharge-sustaining secondary emission. As a result, the discharge extinguishes until surface contaminants return. This new TMM discharge has been shown to occur indefinitely for a constant contamination source at a range of rf voltages. Both TMM frequency and intensity have been shown to depend on the contamination rate and the rf voltage relative to E1, and experimental TMM results are shown for copper and aluminum. Experimental results are presented along with supporting Monte Carlo electron-tracking simulation results.
Keywords :
Monte Carlo methods; aluminium; copper; electron-surface impact; high-frequency discharges; plasma materials processing; secondary electron emission; surface treatment; Al; Cu; Monte Carlo electron-tracking simulation; discharge-sustaining secondary emission; electrode secondary electron coefficient; electron energy distribution; electron impact energy; multipactor discharge; pulsed mode; surface contaminants; transient mode; Copper; Electrodes; Electron emission; Fault location; Frequency; Resonance; Surface cleaning; Surface contamination; Surface discharges; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science - Abstracts, 2009. ICOPS 2009. IEEE International Conference on
Conference_Location :
San Diego, CA
ISSN :
0730-9244
Print_ISBN :
978-1-4244-2617-1
Type :
conf
DOI :
10.1109/PLASMA.2009.5227312
Filename :
5227312
Link To Document :
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