DocumentCode :
3211893
Title :
A methodology for accurate assessment of soft-broken gate oxide leakage and the reliability of VLSI circuits
Author :
Mason, P.W. ; La Duca, A.J. ; Holder, C.H. ; Alam, M.A. ; Hwang, D.K.
Author_Institution :
Agere Syst., Allentown, PA, USA
fYear :
2004
fDate :
25-29 April 2004
Firstpage :
430
Lastpage :
434
Abstract :
We present a comprehensive methodology for modeling, as a function of time, increased standby leakage current of VLSI circuits due to soft-breakdown. Predictions, using a post-soft-breakdown leakage-scaling model and device-level time-dependent dielectric breakdown (TDDB) data, agree remarkably well with observations of circuit leakage. The implications of this predictive model for the leakage current regarding the appropriate evaluation of the absolute reliability of intrinsic, ultra-thin oxides are discussed.
Keywords :
VLSI; electric breakdown; integrated circuit modelling; integrated circuit reliability; leakage currents; VLSI circuits; absolute reliability; accurate assessment; device-level time-dependent dielectric breakdown; post-soft-breakdown leakage-scaling model; reliability; soft-broken gate oxide leakage; standby leakage current; ultra-thin oxides; Circuit testing; Electric breakdown; Integrated circuit reliability; Integrated circuit testing; Inverters; Leakage current; Predictive models; Reliability theory; Stress; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
Type :
conf
DOI :
10.1109/RELPHY.2004.1315366
Filename :
1315366
Link To Document :
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