Title :
Different electrical measuring techniques of package and interconnect parasitics for high speed VLSI devices
Author :
Huang, C.C. ; Wong, Florence ; Kim, Daniel
Author_Institution :
VLSI Technol. Inc., San Jose, CA, USA
Abstract :
This paper will discuss several measuring techniques that are used in the industry today for extraction of electrical parasitics of packages and interconnects. Specifically, the techniques that will be covered are the SEMI-Standard (G23-84) method, the impedance method, and the network analysis method. The data measured from these methods will be presented. Theoretical analysis and simulation results from software will be compared to discuss the advantages and disadvantages of each method
Keywords :
VLSI; SEMI-Standard G23-84 method; electrical measuring techniques; electrical parasitics; high speed VLSI devices; impedance method; interconnects; network analysis method; packages; simulation software; Electric resistance; Electric variables measurement; Electrical resistance measurement; Electronics packaging; Equations; Impedance measurement; Inductance measurement; Parasitic capacitance; Velocity measurement; Very large scale integration;
Conference_Titel :
Northcon/94 Conference Record
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-9995-1
DOI :
10.1109/NORTHC.1994.643327
