Modeling capacitive links for broadband inter-chip communication

This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.