DocumentCode
3212268
Title
Electrical fails specific to Pressure Cooker Test
Author
Wiggins, Lovell ; Perry, Charles ; Coffin, Jefiey ; Dyll, Edward ; Fausse, Michel ; Masanori, Kuzuno
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
fYear
2004
fDate
25-29 April 2004
Firstpage
531
Lastpage
536
Abstract
This paper emphasizes the need for thorough failure analysis and understanding of the failure mechanism to utilize the Pressure Cooker Test (PCT). The high relative humidity extracted bromide ions from the Flip Chip Plastic Ball Grid Array (FCPBGA), which catalyzed growth of unusual tin oxides and drove the extrusion of solder causing shorts.
Keywords
ball grid arrays; electric breakdown; plastic packaging; semiconductor device breakdown; semiconductor device reliability; Flip Chip Plastic Ball Grid Array; Pressure Cooker Test; failure analysis; failure mechanism; solder causing shorts; Circuit testing; Electronic components; Electronic equipment testing; Failure analysis; Flip chip; Humidity; Lead; Temperature; Thermal stresses; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN
0-7803-8315-X
Type
conf
DOI
10.1109/RELPHY.2004.1315385
Filename
1315385
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