Title :
Electrical fails specific to Pressure Cooker Test
Author :
Wiggins, Lovell ; Perry, Charles ; Coffin, Jefiey ; Dyll, Edward ; Fausse, Michel ; Masanori, Kuzuno
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
This paper emphasizes the need for thorough failure analysis and understanding of the failure mechanism to utilize the Pressure Cooker Test (PCT). The high relative humidity extracted bromide ions from the Flip Chip Plastic Ball Grid Array (FCPBGA), which catalyzed growth of unusual tin oxides and drove the extrusion of solder causing shorts.
Keywords :
ball grid arrays; electric breakdown; plastic packaging; semiconductor device breakdown; semiconductor device reliability; Flip Chip Plastic Ball Grid Array; Pressure Cooker Test; failure analysis; failure mechanism; solder causing shorts; Circuit testing; Electronic components; Electronic equipment testing; Failure analysis; Flip chip; Humidity; Lead; Temperature; Thermal stresses; Tin;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
DOI :
10.1109/RELPHY.2004.1315385
