• DocumentCode
    3212293
  • Title

    Automating the packaging selection of VLSI systems

  • Author

    Panzer, Gary W.

  • fYear
    1993
  • fDate
    5-6 Mar 1993
  • Firstpage
    109
  • Lastpage
    113
  • Abstract
    An automated, structured process was developed to strategically focus the package selection of VLSI systems. A structured computer-aided engineering program was developed to anticipate, rather than simply react to, the life-cycle implications of the packaging selection. This tool provides the user with quick what-if analysis on various packaging implementations of the targeted electronic system during the conceptual phase. Input to the estimator is a description of the number and types of components of the system. Output is a component count comparison of six different technology implementations of the same system. The technologies currently implemented are discrete/IC, field programmable gate array, application-specific integrated circuit, hybrid microelectronic assembly, multichip module, and monolithic wafer-scale integration. In addition, the output includes tradeoffs due to gate counts, engineering costs, production costs, circuit board areas, power, and reliability
  • Keywords
    VLSI; electronic engineering computing; integrated circuit technology; packaging; ASIC; FPGA; MCM; VLSI systems; WSI; application-specific integrated circuit; computer-aided engineering; estimator; field programmable gate array; hybrid microelectronic assembly; monolithic wafer-scale integration; multichip module; packaging selection; structured CAE program; Application specific integrated circuits; Assembly; Costs; Electronics packaging; Field programmable gate arrays; Hybrid integrated circuits; Integrated circuit technology; Microelectronics; Monolithic integrated circuits; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 1993. 'Design Automation of High Performance VLSI Systems', Proceedings., Third Great Lakes Symposium on
  • Conference_Location
    Kalamazoo, MI
  • Print_ISBN
    0-8186-3430-8
  • Type

    conf

  • DOI
    10.1109/GLSV.1993.224468
  • Filename
    224468