Parameter analysis of hot plate based on uniform design

In lithography process, wafers need to be baked on the hot plate. There are very high requirement to the temperature uniformity of hot plate surface. To the problem of choosing design parameters, the uniform design method and the simulation software ANSYS were used, the design parameters were analyzed on the various conditions. Then a regression model was obtained by dealing with these simulation data in quadratic regression. Test proven that the calculation result of the regression model is highly consistent with the result of simulation. So, the obtained regression model can be useful to choose the design parameters, it has practical value in the engineering.