DocumentCode :
3212644
Title :
Gate oxide multiple soft breakdown (Multi-SBD) impact on CMOS inverter
Author :
Huang, Huey-Ming ; Ko, C.Y. ; Yang, M.L. ; Liao, P.J. ; Wang, J.J. ; Oates, Anthony ; Wu, Kenneth
Author_Institution :
Taiwan Semicond. Manuf. Co. Ltd., Hsin-Chu, Taiwan
fYear :
2004
fDate :
25-29 April 2004
Firstpage :
593
Lastpage :
594
Abstract :
The impact of gate oxide multiple soft breakdown (Multi-SBD) on the performance of CMOS inverter has been demonstrated. The results indicate that the CMOS inverter is still functioning when Multi-SBD event occurs, but noise margin degraded rapidly after extending a period of time. Moreover, off-state leakage current increasing and gate induced drain leakage (GIDL) phenomenon are other concerns. Multi-SBD may be acceptable in reliability viewpoint and the results also imply that we can relax the failure criteria of gate oxide reliability to allow a higher operation voltage, but it must depend on circuit design and application rather for all cases.
Keywords :
CMOS integrated circuits; dielectric thin films; integrated circuit reliability; invertors; leakage currents; semiconductor device breakdown; CMOS inverter; circuit design; gate induced drain leakage; gate oxide multiple soft breakdown; gate oxide reliability; higher operation voltage; noise margin; off-state leakage current; Breakdown voltage; CMOS digital integrated circuits; Degradation; Digital circuits; Electric breakdown; Energy consumption; Inverters; Leakage current; MOSFET circuits; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
Type :
conf
DOI :
10.1109/RELPHY.2004.1315405
Filename :
1315405
Link To Document :
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