Title :
Thermomechanical behavior and reliability of Au/Si MEMS structures
Author :
Miller, David ; Herrmann, Cari ; Spark, Kevin ; Finch, Dudley ; George, Steve ; Stoldt, Conrad ; Gall, Ken
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
Our work with micromechanical structures investigates the magnitude and physics of inelastic behavior at various thermomechanical-loading conditions. We also seek to achieve greater mechanical stability, for example using nanometer-thick atomic-layer deposition (ALD) coatings.
Keywords :
atomic layer deposition; elemental semiconductors; gold; micromechanical devices; semiconductor device reliability; semiconductor-metal boundaries; silicon; thermomechanical treatment; Au-Si; Au/Si MEMS structures; micromechanical structures; nanometer-thick atomic-layer deposition coatings; reliability; thermomechanical behavior; Biological materials; Coatings; Gold; Isothermal processes; Micromechanical devices; Nonhomogeneous media; Optical materials; Structural beams; Temperature; Thermomechanical processes;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
DOI :
10.1109/RELPHY.2004.1315425
