DocumentCode :
3213096
Title :
A method to reduce power dissipation during test for sequential circuits
Author :
Higami, Yoshinobu ; Kobayashi, Shin-ya ; Takamatsu, Yuzo
Author_Institution :
Dept. of Comput. Sci., Ehime Univ., Matsuyama, Japan
fYear :
2002
fDate :
18-20 Nov. 2002
Firstpage :
326
Lastpage :
331
Abstract :
For recent VLSIs designed for low power, reduction of power dissipation during test is one of the most important problems. This paper presents a method to reduce power dissipation during test for sequential circuits. The goal is to obtain test vectors for sequential circuits that achieve low power dissipation. In our method, test vectors generated by ATPG are given and they are improved to reduce power dissipation without losing the original stuck-at fault coverage. Due to the correlation between power dissipation and the number of transition gates, the number of transition gates is evaluated for each test vector during modification of test vectors. In order to keep the original fault coverage, logic simulation and fault simulation are performed, every time a test vector is modified. The effectiveness of our method is shown by experimental results for ISCAS ´89 benchmark circuits.
Keywords :
CMOS logic circuits; VLSI; automatic test pattern generation; fault simulation; integrated circuit testing; logic simulation; logic testing; low-power electronics; sequential circuits; ATPG; CMOS circuits; fault simulation; heuristic algorithms; logic simulation; low power VLSI; low power dissipation sequential circuit test vectors; sequential circuit test; stuck-at fault coverage; test power dissipation reduction methods; test vector modification; transition gate number; Automatic test pattern generation; Circuit faults; Circuit simulation; Circuit testing; Logic testing; Power dissipation; Power generation; Sequential analysis; Sequential circuits; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Symposium, 2002. (ATS '02). Proceedings of the 11th Asian
ISSN :
1081-7735
Print_ISBN :
0-7695-1825-7
Type :
conf
DOI :
10.1109/ATS.2002.1181732
Filename :
1181732
Link To Document :
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