Title :
Microsystems for three axis active fiber alignment
Author :
Wood, R.L. ; Dhuler, V.R. ; Haake, J.M. ; Cowen, A.B.
Author_Institution :
MCNC, Research Triangle Park, NC, USA
Abstract :
We report on development of novel microsystems capable of three-axis active in-package fiber alignment with submicron tolerances. Existing procedures for aligning fiber optics and micro-optics are very labor and capital intensive. The packaging of individual single mode opto-electronic components currently dominates the photonic device product cost, limiting their implementation in the market place. Solutions for passive alignments with tolerances of few microns (not adequate for single mode coupling) have been demonstrated. Microsystems presented here are batch fabricated using a combination of silicon micromachining and LIGA.
Keywords :
LIGA; micro-optics; micromachining; micromechanical devices; optical communication equipment; optical fabrication; optical fibre couplers; packaging; LIGA; capital intensive; fiber optics alignment; individual single mode opto-electronic components; market place; micro optics; packaging; photonic device product cost; silicon micromachining; single mode coupling; submicron tolerances; three axis active fiber alignment microsystems; three-axis active in-package fiber alignment; Actuators; Counting circuits; Etching; Micromechanical devices; Nickel; Optical fiber devices; Optical fiber testing; Semiconductor device measurement; Silicon; Springs;
Conference_Titel :
Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-4953-9
DOI :
10.1109/LEOSST.1998.689726
