Title :
Multilevel Metal Interconnect For VLSI Circuits Using Polyimide Dielectrics
Author_Institution :
Mississippi State University
Keywords :
Aluminum; Conductors; Dielectric thin films; Dielectrics and electrical insulation; Integrated circuit interconnections; Plasma properties; Plasma temperature; Polyimides; Silicon; Very large scale integration;
Conference_Titel :
Southeastcon '81. Conference Proceedings
Conference_Location :
Huntsville, AL, USA
DOI :
10.1109/SECON.1981.673389
